» Specialize in difficult Ball Grid Array repairs
» Full Scale Production Capacity BGA-Reballing
» Routinely Work with quantities of one to one thousand
» Have the in-house expertise to solve challenging BGA problems
» Complete Test and Repair Depot Facility
» Mechanical Process Design Center
» Cost effective outsource solution
» Best response time
» Our customers are our first priority
The work we have received has been excellent and prompt, which has helped greatly in closing schedule gaps.
Mike Hanlon Smith's Aerospace - Germantown, MD
• ECN
• Re-Balling
• Post production validation
• Fault detection and Evaluation
• Prototype Board Builds
• Machine and Hand Build
• Fine Pitch
• Kit or Turnkey
• Quick Turn
• uBGA, PBGA, TBGA
• Tool and Die
• Prototyping
• CAD Concept and Design
• Assembly Aids
eTech-WEB builds, repairs and upgrades printed circuit boards with quality, value and exceptional customer service. eTech-WEB serves Original Equipment Manufacturers, Contract Manufacturers, Industry, Higher Education and Government.
• Quick turn available
• Quantities 1 to 10,000+
• UBGA,PBGA,CBGA, TBGA
ConversionConversion
• Prototype Board Builds
• Small Production Runs
• Machine and Hand Build
• BGA, QFP, Fine Pitch
• X-Ray Inspection
• Kit or Turnkey
• Custom Designed Test Fixtures
• Custom Designed SRT Nozzles
• Custom Design and Fabrication of Stainless, G10 and various other materials
RoHS BGA Conversion
Many chip manufacturers have abandoned lead Ball Grid Array Users by no longer offering lead BGA components. eTech can remove lead-free BGA solder spheres and re-ball them with lead spheres This cost effective solution allows eTech's BGA re-ball customers to continue leaded processes in exempt areas or until they choose to convert to a RoHS compliant assembly processes.
Wire Add and Trace Repair
eTech takes pride in our ability to repair trace and pad damage as well as do Wire Adds beneath Fine pitch BGA's
Post Production Validation
Soft copy x- Ray images can be provided to you on CD or E-mail. These images can be provided to end-users as validation of BGA and fine pitch placement. This service is available for components eTech places as well as customer placed components.
