What do I need to provide to do 5DX inspection?
You must have a CAD file, a BOM and a build classification. Gerber files and assembly drawings my be required. A complete rundown of requirements can be found here.
Can you assemble from trays, or do you require tape-and-reel?
What is involved in BGA reballing?
We will complete assembly from either.
- Bake PCB – BGAs must be free of moisture prior to removing them from a PCB. The chip
can be dried by baking the entire PCB per JEDEC standards (usually 125°C for 24 hours,
but each board must be evaluated first). This removes moisture from the chip and PCB and
eliminates the risk of “popcorning” the internal die of the BGA. If baking is not performed
the component may be damaged. If damage does occur, the BGA cannot be repaired.
Popcorning is often not visible to the naked eye and may only become apparent once the
chip is placed back in service. eTech has the capacity to bake PCBs up to 33”x26”. We
have multiple ovens and can accommodate a large quantity of PCBs and BGAs at one
- Remove BGA – The BGA removal process is performed using custom thermal profiles for
each PCB and BGA location. Our operators are trained to spot potential problems during
the BGA removal process.
- Bake BGA – BGAs must be dry before reballing can be attempted. BGAs do not need to
be re-baked if they have not been subjected to atmospheric moisture after being removed
from the PCB. BGAs that have been exposed to moisture in excess of the manufacturers’
moisture rating are baked 24 hours at 125°C. eTech’s philosophy is, “If in doubt, bake,
because there is no such thing as too dry”.
- Site Dress BGA – eTech dresses BGA’s by hand under a microscope, removing the
existing solder and cleaning the surface. Great care is taken to restore the component to its
original condition, if possible.
- BGA Inspection – eTech carefully inspects each BGA under a microscope.
- Paste High Temperature BGA – Pasting is generally only required on high-temp BGAs
to create a fillet around the spheres that do not reach reflow temperature during the BGA
- Place BGA Solder Spheres – eTech designs and manufactures custom tooling for the
application of solder spheres on BGAs. This gives eTech the flexibility to accommodate
customer BGA reballing requirements including fine pitch (down to .4mm) and mixedpitched
arrays, and to provide quick-turn reballing of small quantities as well as quantities
of greater than 10,000 pieces. We use top quality, high tolerance solder spheres in our
BGA reballing process. We stock both standard and metric sizes of lead and lead-free
solder spheres. We keep more than 5 million spheres in stock to meet our customer’s BGA
- Reflow BGA – A thermal profile is developed and the BGA is heated to complete the
process. Reballing temperatures are generally cooler than PCB assembly temperatures, as
both sides of the component are exposed.
- BGA Reball Inspection Process – each reballed BGA is inspected after reflow to ensure
adequate reflow, co-planarity, bridged spheres, etc.
- Clean/Wash Reballed BGA – isopropyl alcohol and water are used to hand wash the
- BGA Reball Inspection Process – each reballed BGA is inspected again to check for
cleanliness and any defects that might have been missed.
- Bake Reballed BGA – Depending on the process and chemistry used, reballed BGA’s
are re-baked at 125°C to ensure that the BGA’s are dry and ready to encounter reflow
temperatures during manufacturing.
- Mark or Dot BGA – eTech’s standard practice when reballing BGAs is to mark each chip,
usually with a red dot on the top side of the BGA in the pin one corner. We can vary the
color of the dot or use custom marking on request.
- Pack / Seal / Certificate of Compliance – Reballed BGAs are vacuum-packed
and sealed in moisture-proof, antistatic bags. Moisture indicator strips and desiccant
are included. We include a certificate of compliance for each job.
Do you have to bake my BGAs? How long will that take?
We recommend baking BGAs to meet with Joint Industry Standard Baking and Moisture