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Ball Grid Array Reballing Services
   
 
BGA Reballing Service Offered  
   
• Lead Free BGA’s
• Eutectic SnPb BGA’s
• 0.5 mm Pitch
• 0.75 mm Pitch
• 0.8 mm Pitch
• 1.0 mm Pitch
• 1.27 mm Pitch
• 1.5 mm Pitch
• Non Standard and mixed Pitch Components
• Lead Free to Lead Conversion
• Lead to Lead Free Conversion
 
BGA Reball Process
 
Most BGAs can be reballed if the removal and attachment is handled properly. The heat required to remove, reball or place a BGA is high enough that excess moisture trapped in the component package can cause the BGA to "popcorn" during any part of this process. Therefore, in order to increase quality of rework, proper care should be taken when it is determined that BGA rework is necessary. BGA Reballing has been shown to be just as reliable as from the factory BGA Reballing if all ESD and thermal safety issues are addressed.
BGA Reballing / Reballing
Reballed BGA
 
   

eTech recommends the following for BGA Reballing:

  1. If the BGA needs to be removed and reballed, the entire board should be baked before the BGA is removed. This dries out the component and eliminates moisture that can cause the BGA or board itself to delaminate or "popcorn". The baking process is done at 125 degrees Centigrade for 24 hours. Lower baking temps can be accommodated with longer baking times. Always bake the board to removing the Ball Grid Array if BGA reballing is required after rework.
  2. After baking, the BGA can be removed per the BGA rework process that observes manufacturer's rework temperature guide lines. eTech has the experience and expertise in setting up thermal profiles to remove BGAs and eTech will be happy to remove components from boards or assist you with the technical aspects of the process.
  3. The BGA (and PCB) must then be site dressed to remove all excess solder. For BGA reballing, this is an important step because care must be taken not to damage the BGA itself and to ensure that no popcorning has occurred.
  4. After the BGA has been prepared, eTech can then add solder spheres based on pad site size and manufacturer's specs.
  5. The BGA is then cleaned and is ready for placement.
  6. eTech's core competency is to place BGAs, so we can either place the BGA for our customers or send back for future use after BGA Reballing.

eTech has the ability to reball many different types of components including CBGA, PBGA, TBGA as well as others. Please note that CCGA (Ceramic Column Grid Array) are not classified as BGA Reballing as the technology used in them is not solder spheres but ceramic columns.

The following information is always helpful in determining reballing specs:

  • BGA manufacturer's data sheet including pad layout, ball size and solder type
  • Pb or Pb Free (Lead or Lead free)

If timing is an issue, eTech offers a quick 24 hour turn on reballing services. The only caveat is that the turn time is in addition to the bake time required before the board can be reworked.

Give eTech a call today and let us assist you in solving your BGA Reballing needs.