BGA Inspection for Poor Wetting / Insufficient – (X-Ray)
eTech's BGA Inspection procedures can identify poor wetting and
insufficient reflow of a reworked BGA component.

BGA Inspection for Diameter, area and Joint Density -
(X-Ray)
Calculation of Various measurements such as diameter, area, and joint density of solder balls on a BGA placement can be analyzed at eTech

BGA Inspection and Analysis tool – (X-Ray)
Areas of interest can be analyzed within the BGA and balls above or below a specified size can be highlighted

BGA Inspection using 3D Rendering - (X-Ray)
This is an example of 3D rendering. In this example, voids are pronounced and easily detectible

BGA Inspection using Pseudo Color Filter Analysis - (X-Ray)
Our Pseudo Color filter tool enhances the analysis of voiding. A percent analysis can be performed on any area of interest

Gull Wing Alignment - (X-Ray)
This example shows and example of an axis view of a .5mm gull wing lead

Wirebond Analysis - (X-Ray)
This example is a view of wirebonds at high magnification

BGA Inspection using Contour Relief Filter - (X-Ray)
Contour filter highlights any voiding within each solder ball.